PureLab Glove Box Chamber Evaporator

OLED & PLED Thin Film Deposition Evaporator Systems

Glove Box Chamber PVD Vacuum Coating Systems

Innovative Technology, Inc modular (PVD) vacuum coating systems are designed specifically to meet the needs of current research, development and pre-production applications. These modular PVD systems provide the flexibility to configure an advanced system that can be easily upgraded as your technology develops.

The PureLab Box Chamber Evaporator System base configuration consists of a control interface and an enclosed frame for the high vacuum chamber.

The PureLab High Vacuum Box Chamber Evaporator System is specially designed for easy glove box integration. With the glove box integration these PVD Systems are perfectly suited for laboratory scale thin film deposition processes highly sensitive to atmospheric conditions.

The system is capable of handling single large diameter substrates or multiple small substrates on a single substrate holding plate. The system allows a variety of process combinations including resistive thermal evaporation, electron beam and sputtering applications.

Available Features

The PureLab high vacuum Box Chamber Evaporator System offer superior standard features for a very competitive price, and can be shipped from our facility in as little as 16 weeks. Powerful process features have been designed into a small system footprint, making the PureLab Evaporator Systems a perfect solution for restricted lab space or multiple system integrations. The following information details the system features available in every base system.

• Universal Ø20" Base Flange Weldment
• Separate Control Rack and Base Frame
• Cryogenic Pumping Package
• Turbo Molecular Pumping
• 10 cfm Rotary Vane Mechanical Pump
• 4U Rack-Mount PC Computer
• PLC Operating System
• PLC Control Interface Software
• Pneumatic Vacuum Control Valving
• Full-Range Vacuum Pressure Gauge

Thin Film Deposition Process Applications

Our PureLab thin film deposition systems are engineered for diverse PVD applications. Please speak to your Innovative technology, inc concerning any of the following process applications that may be of interest to you.

• Thermal Evaporation
• Direct Current DC Sputtering
• Radio Frequency RF Sputtering
• Electron Beam Evaporation
• DC and RF Sputter Deposition
• Combined Resistive Sputter and Electron Beam
• In Situ Substrate Heating up to 600ºC
• Glow Discharge Plasma Cleaning
• OLED and LED Research and Fabrication
• Thin Film Photovoltaic Research and Development
• Thin Film Nanotechnology
• Materials Research
• Lens Coating
• Semiconductor
• Memory Storage Devices
• Organic Research and Technology
• Thin Film Medical Devices
• Pharmaceutical Applications
• Metallization

Resistive Thermal Evaporation
Designed for research and development involving organic materials science, organic light emitting diode technology, and flexible OLED display barrier coatings. Research fields include organic light emitting diodes (OLED), flat panel displays, solar panels, photovoltaics, nanotechnology, materials science, thin film battery metallization and much more.

Electron Beam Evaporation
For research and development involving high vacuum evaporation of pure metallic elements in addition to numerous alloys and compounds. Thin film research applications making use of electron beam evaporation technology include medical, metallurgical, telecommunication, micro electronics, optical coating, nanotechnology and the semiconductor industry.

Magnetron Sputter Deposition
Research and development involving photovoltaic and optoelectronic materials and devices. Our magnetron sputtering system may be easily adapted for a variety of leading edge research fields including organic light emitting diodes (OLED), flat panel displays, solar panels, photovoltaics, nanotechnology, materials science and much more.

OPTIONS

Special Substrate Holders and Mask Holders
We have capabilities in stencil mask fabrication, mask changers, etc. Contact factory for additional information and design constraints. Substrate heat Glow discharge or plasma cleaning
Spin Coaters
User-friendly touch screen interface and display 700 process programs 20 steps per program (upgradable with software option) 0.1-second resolution for step times (0 to 999.9 sec/step) Spin speed: 0 to 6,000 rpm Spin speed acceleration 0 to 30,000 rpm/sec unloaded 0 to 23,000 rpm/sec for a 200 mm substrate 0 to 3,000 rpm/sec for a 6" x 6" x .250" photomask recessed chuck
Precision
Spin speed repeatability:	< 0.2 rpm
Spin speed resolution:	< 0.2 rpm
Substrate sizes:	< 1 cm to 200 mm round / 6" x 6" square
Reliability
Indirect drive system protects the spin motor from accidental contact with process chemicals and solvents Vacuum and lid interlock standard
Bowl Design
Stainless steel construction ETFE-coated spin bowl option for material compatibility Optional polyethylene liners available Optional polyethylene/Teflon splash ring Closed and optional open lid designs for process flexibility Drain and exhaust ports located in the bottom of the bowl

Hot Plates
Operation	Manual Load
Process Control	Program
Temperature Resolution	1ºC
Temperature range	50-600ºC
Substrate Size	6"

UV Cleaning

UV ozone cleaning system that will not damage delicate electronic devices. This easy to operate system uses a unique combination of ultraviolet radiation, ozone, and heat to gently, yet effectively, remove organic materials from a variety of substrates, including: silicon, gallium arsenide, sapphire, metals, ceramics, quartz and glass. The versatile UV-1 is well-suited for a variety of applications such as substrate cleaning, photoresist descumming, improving wettability, and UV curing. By operating at atmospheric pressure, the UV-1 eliminates the need for a cumbersome, high maintenance, vacuum system. This system is specifically designed to be used in a inert Glove Box application.

Desktop Dispensing Robots
Model I&J4100-LF is a compact Cartesian robot featuring all the programming functions and the same memory capacity of the larger I&J7000 industrial robots. The I&J4100-LF is an ideal bench robot for automated dispensing when cost and bench space are important considerations. The dispensing robot has a working area 7.87 x 5.9 (200mm x 150mm) and can accept dispensing valves and syringes with tooling loads of 3Kg and 1Kg.
Features
Dispensing area of 7.87 x 5.9 (200mm x 150mm) Repeatability 0.01mm for precision dispensing No computer skills required 100 programs, 4000 points per program Continuous path motion for accurate XYZ dispensing Interpolates lines or arcs for three-dimensional dispensing Teach Pendant and PC programming.
Models (110V/220V CE)
I&J4100-LF 3-Axis Dispensing Robot
I&J4100-LF desktop robot specifications
XYZ Robot Working Area/ mm:	200 / 150 / 50
Load Worktable/Tool:	3kg / 1kg
Speed PTP XY& Z (mm/sec):	500 / 250
Repeatability:	+/- 0.04mm/ Axis
Resolution:	0.02mm/Axis
Data Memory:	100 programs 4000 points/program

Ovens / Furnaces
Innovative Technology, Inc provides both custom and standard integrated vacuum process Ovens and Furnaces ranging up to 1200 degrees Celsius. Below are some photographs of various configurations that are available. All Innovative Technology, Inc Process Ovens and Furnaces are fitted with the latest in temperature, cycle time controls as well as safety parameters allowing for your operators to work in a safe environment. Pressure and temperature performance, constant chamber temperature and vacuum level are made possible by means of a doors seal made from a latest in gasket technology resulting in a hermetically sealed Glove Box and Process Oven integration.
Specifications - SalvisLab Vacucenter VC20 VC50
Useable volume:	(l) 20 50
Max. Temperature (ºC):	200 200
Outside dimensions (WxHxD):	mm 545x375x425 645x475x525
Inside dimensions (wxhxd):	mm 250x250x320 350x350x420
Weight (kg):	34 56
Shelves (standard/max.):	1/3 1/5
Shelf load max. (kg):	20 20
Voltage:	±10% (V) 230/115 230/115
Temperature variation at 100ºC:	(±ºC) 1.7 1.7
Temperature fluctuation at 100ºC:	(±ºC) 0.2 0.2
Microprocessor:	PID controller
Alphanumeric LCD display:	illuminated
Programming:	Programs x steps 50 x 15 50 x 15 Temperature, time, gradient
Timer (h):	999 999
RS232/RS422 interface:	optional
Digital vacuum indication or control:	optional
Vacuum pump:	optional
Safety class:	3.1